Neues thermisches Material kann den Kühlbedarf von Rechenzentren um 13 Prozent senken

Summary:

Meeting the world’s data storage demands [is costly](https://www.sciencealert.com/google-pivots-to-nuclear-reactors-to-power-its-artificial-intelligence), in terms of money, energy, and environmental impact – but a new material could significantly improve the cooling of our data centers while also making our home and business electronics more energy efficient.

Currently, bulky and energy-intensive cooling solutions are typically deployed to chill out the hardware holding our data, adding up to [about 40 percent](https://www.energy.gov/articles/doe-announces-40-million-more-efficient-cooling-data-centers) of overall data center energy use (around 8 terawatt-hours every year).

The team from the University of Texas at Austin and Sichuan University in China [estimates](https://cockrell.utexas.edu/news/archive/10078-new-thermal-interface-material-could-cool-down-energy-hungry-data-centers) around 13 percent of those 8 terawatt-hours could be shaved off by their new organic [thermal interface material](https://en.wikipedia.org/wiki/Thermal_interface_material) (TIM).

The TIM substantially boosts the rate at which heat can be taken away from active electronic components and channeled into a heatsink for air or water to carry away.

That in turn means a lower demand on active cooling technologies, including fans and liquid cooling.

Read the peer-reviewed paper: [https://www.nature.com/articles/s41565-024-01793-0](https://www.nature.com/articles/s41565-024-01793-0)

That’s a huge, a 13% cut in cooling demands could save tons of energy and lower costs. Let’s hope this tech gets widely adopted – our planet could use the break.

Cool, how about gaming laptops? Cause God damn these things laptops run hella hot.